𝐑𝐞𝐟𝐥𝐨𝐰 𝐬𝐨𝐥𝐝𝐞𝐫𝐢𝐧𝐠 𝐩𝐫𝐨𝐜𝐞𝐬𝐬 𝐦𝐢𝐧𝐢 𝐠𝐮𝐢𝐝𝐞

I want to tell more about the process of solder paste printing. The reflow soldering process naturally contains more steps than the solder paste printing. Regarding the sensitivity to failures, the solder paste printing drives the entire job. The fine component pitch requires "finer" solder paste types. The word finer means finer solder paste powder distribution. In other words, the solder paste particles are smaller and homogeneously distributed. The solder paste temperature when printing must be your concern as well. Too-liquid solder paste does not keep its shape, while too-thick solder paste does not enter the stencil openings. The other trap is that the optimal temperature window for the solder paste printing is relatively narrow. It means you must cool down the paste after a few print runs.