Do I Need to Turn Off Thermal Relief When Adding Vias on a Ground Pad?
Guys I have a component with QFN package as shown in the picture. Is it okay if I add vias as shown (0.35mm outer, 0.2mm inner) on the ground pad, since I'm not able to route a trace inside? I believe I need to "turn off thermal relief" or something along those lines if I'm doing this. Can someone help me with this please? Thanks in advance @Joseph Ogbonna Can you please share your thoughts on this?
